CyberOptics® Corporation, a leader in global development and manufacturer of high-precision 3D sensing technology solutions, will showcase itself at SEMICON West, July 9-11, 2019 in booth #5769 at the Moscone Center in San Francisco, CA.
OEMs and Semiconductor fabs place high value on the precision, accuracy as well as the versatility of the WaferSense AVLS3 – which happens to be the most effective and efficient wireless measurement device for vibration and leveling.
At the value of 3.5mm, AVLS3 has to travel with ease to the best of locations where a wafer travels. The Chemically Hardened Glass (CHG) substrate allows for smooth wafer handling and enhanced vacuum chucking.
Having a long-range wireless capability, AVLS3 combined with new, easy-to-use CyberSpectrum software, retrieves and displays leveling and vibration data concurrently for alignment, fast equipment set-up, and real-time equipment diagnostics.
In addition to this, for mid-end and advanced packaging inspection and measurement, CyberOptics will showcase the new proprietary NanoResolution Multi-Reflection Suppression (MRS) sensor technology which carefully identifies and refuses multiple reflections as a result of shiny components and mirror-like surfaces. Effectively suppressing multiple reflections is essential for highly accurate measurements.
Giving an unparalleled combination of high accuracy, high resolution and speed, MRS sensors are largely used for inspection and measurement in the SMT, semiconductor and metrology markets. The new 3-micron NanoResolution MRS sensor helps to achieve metrology grade accuracy with superior 100% 2D and 3D inspection performance for characteristics as small as 25-micron.
Moreover, it is two to three times faster than alternate solutions in the marketplace. Having data processing speeds of over 75 million 3D points per second, the NanoResolution MRS sensor supplies throughout greater than 25 wafers (300mm) per hour.
This one-of-a-kind MRS sensor technology is perfectly suited for the inspection of IC package, CPU sockets, copper pillars, solder balls and bumps, and other advanced packaging and mid-end semiconductor applications where speed and high precision are required.