Wiwynn Exhibits Immersion Cooling Solutions at OCP Global Summit 2019

Wiwynn, a provider of innovative cloud infrastructure showcased its two-phase immersion cooling systems, which was created with Open Compute Project (OCP) servers to work on the rapidly increasing power consumption and computing density, while supplying efficiency in terms of power and cooling, reliability and serviceability advantages.

The immersion cooling solution being exhibited by Wiwynn is consistent with OCP servers at OCP Global Summit this year, in San Jose Convention Center, booth #A12, which already kicked off on the 14th of March and would end on the 15th of March.

The two-phase immersion cooling tank has taken away every need for heat sinks, fans and facility air conditioners. It also cuts down the failure seen in systems, which is actually caused by dust, air and static electricity. This encourages lower PUE with a density of higher commute, which is up to 100 two-socket servers and also supply solutions to users; solutions air cooling can never provide.

Thanks to Wiwynn’s 48V technology and power pooling, a great deal power efficiency and optimization of energy utilization is now available.

Also, Wiwynn checks out liquids from various vendors, servers and motherboards. This includes Microsoft’s Project Olympus specification and OCP TiogaPass.

Wiwynn has spent an adequate period of time working to innovate two-phase immersion solution; one which provides easy maintenance with a lesser rate of power consumption, and high performance.

This great innovation and this type of innovative thinking coming from Wiwynn is not so surprising, as Wiwynn is known for providing only computer and storage solutions of high quality and rack solutions for the centers that are leaders. The company strongly believes in massively investing in technology specially wired for the next generation.

More details on their amazing innovation will be revealed by the company at the engineering workshop sessions of OCP US summit on today, the 15th of March, 2019.